Topscom is a manufacturer for circuit boards with 2300 employees, we have received the TUV UL CE Nemko VDE CB Certification etc, our price is so competitve moreover our quality is guaranteed, so many clients is so interested in our products. The circuit boards spec as follows:

Layers: Single-sided PCB; Double-sided PCB; Multi-layers PCB 4-12
Copper thickness: 1~2OZ; 0. 5~10OZ; 0. 5~10OZ
Material thickness: 0. 6~3. 0mm; 0. 2~3. 2mm; 0. 35~3. 2mm
Flammbility rating: 94V-0; 94V-0; 94V-0
Peel strength: 10. 4N/cm; 12.3N/cm; 12.3N/cm
Warp and twist: Not less than 1.5%; Not less than 1.0%; Not less than 1.0%
Insulation resistor: Less than 1 GOhm; Less than 1 GOhm; Less than 1 GOhm
Test voltage: 50-100DCV; 100DCV; 100-200DCV
Finished board area: 400×500mm; 560×600mm; 560×600mm
Min line width/ spacing: 0.20/0.20mm; 0.10/0.10mm; 0.10/0.10mm
Hole wall copper thickness: Not less than 20. 0um; Not less than20. 0um
Minimum annul ring
Inner 0.05mm
Outer 0.10mm 0.076mm 0.076mm
Min. Diameter 0.60mm 0.25mm 0.20mm

Hole diam tolerance
PTH 0. 076mm 0.076mm
NPTH 0. 076mm 0.05mm 0.05mm

Hole position tolerance 0.076mm 0.076mm 0.05mm

Out-lay tolerance
Routing sign 0.15mm sign 0.15mm sign 0.13mm
Punching sign 0.15mm sign 0.15mm sign 0.15mm

Solder mask bridge: Not less than 8mil; Not less than 4mil; Not less than 3mil
Solder mask hardness: 6H; 6H; 6H
S/m solderability: 245 centigrade 5 Second 245C 5 Second 245C 5 Second
Hot immersionability: 260C 10 Second; 288C 10 Second; 288C 10 Second
Surface plating: OSP, HAL Flash Gold, Colophony OSP, Flash Gold, Immersion Gold, Gold Finger, OSP, HAL, Flash Gold, Immersion Gold, Gold Finger
Quality spec.: GB/T. 4588, IPC-A-600F; IPC-A-600F, IPC-ML-950 IPC-A-600F, IPC-ML-950.